The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Jul. 31, 2008
William Louis Brodsky, Binghamption, NY (US);
John Lee Colbert, Byron, MN (US);
Roger Duane Hamilton, Rochester, MN (US);
Amanda Elisa Ennis Mikhail, Rochester, MN (US);
Mark David Plucinski, Rochester, MN (US);
William Louis Brodsky, Binghamption, NY (US);
John Lee Colbert, Byron, MN (US);
Roger Duane Hamilton, Rochester, MN (US);
Amanda Elisa Ennis Mikhail, Rochester, MN (US);
Mark David Plucinski, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).