The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Jun. 30, 2008
John Lee Colbert, Byron, MN (US);
Eric Alan Eckberg, Rochester, MN (US);
Roger Duane Hamilton, Rochester, MN (US);
Mark Kenneth Hoffmeyer, Rochester, MN (US);
Amanda Elisa Ennis Mikhail, Rochester, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
John Lee Colbert, Byron, MN (US);
Eric Alan Eckberg, Rochester, MN (US);
Roger Duane Hamilton, Rochester, MN (US);
Mark Kenneth Hoffmeyer, Rochester, MN (US);
Amanda Elisa Ennis Mikhail, Rochester, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.