IDiyas

For the Inventor, By the Inventor

Austin, TX, United States of America

Paul Marian Harvey

USPTO Granted Patents = 15 

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 175(Granted Patents)


Company Filing History:

goldMedal11 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal4 out of 14,059 
 
3m Innovative Properties Company
 patents
bronzeMedal1 out of 52,711 
 
Kabushiki Kaisha Toshiba
 patents
where one patent can have more than one assignee

Years Active: 2000-2016

Loading Chart...
15 patents (USPTO):
1. 9456506 - Packaging for eight-socket one-hop SMP topology (2016-09-27),
2. 9445507 - Packaging for eight-socket one-hop SMP topology (2016-09-13),
3. 8791372 - Reducing impedance discontinuity in packages (2014-07-29),
4. 8680670 - Multi-chip module system with removable socketed modules (2014-03-25),
5. 8631706 - Noise suppressor for semiconductor packages (2014-01-21),
6. 8440917 - Method and apparatus to reduce impedance discontinuity in packages (2013-05-14),
7. 8338949 - System to improve coreless package connections (2012-12-25),
8. 8222739 - System to improve coreless package connections (2012-07-17),
9. 7911049 - Electrically optimized and structurally protected via structure for high speed signals (2011-03-22),
10. 7687391 - Electrically optimized and structurally protected via structure for high speed signals (2010-03-30),
11. 7492570 - Systems and methods for reducing simultaneous switching noise in an integrated circuit (2009-02-17),
12. 7388275 - Electronic package with integrated capacitor (2008-06-17),
13. 7064412 - Electronic package with integrated capacitor (2006-06-20),
14. 6150071 - Fabrication process for flex circuit applications (2000-11-21),
15. 6140707 - Laminated integrated circuit package (2000-10-31),

Title: The Innovations of Paul Marian Harvey

Introduction

Paul Marian Harvey is a notable inventor based in Austin, TX, with a remarkable portfolio of 15 patents. His work primarily focuses on advancements in technology, particularly in the field of symmetric multiprocessor topologies. His innovative contributions have significantly impacted the way processors are packaged and connected.

Latest Patents

One of his latest patents is titled "Packaging for eight-socket one-hop SMP topology." This invention provides a mechanism for packaging a multiple socket, one-hop symmetric multiprocessor topology. The mechanism connects each of a first plurality of processor modules to a first multiple-socket planar via a respective one of a first plurality of land grid array (LGA) connectors. Additionally, it connects the first multiple-socket planar to a first side of a redistribution card via a second plurality of LGA connectors. Furthermore, it connects each of a second plurality of processor modules to a second multiple-socket planar via a respective one of a third plurality of LGA connectors. Finally, it connects the second multiple-socket planar to a second side of the redistribution card via a fourth plurality of LGA connectors.

Career Highlights

Throughout his career, Paul has worked with prestigious companies, including International Business Machines Corporation (IBM) and 3M Innovative Properties Company. His experience in these organizations has allowed him to refine his skills and contribute to significant technological advancements.

Collaborations

Paul has collaborated with talented individuals such as Yaping Zhou and John Lee Colbert. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Paul Marian Harvey's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in processor technology and packaging solutions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…