The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Dec. 19, 2009
Applicants:

Paul M. Harvey, Austin, TX (US);

Colm B. O'reilly, Austin, TX (US);

Samuel W. Yang, Austin, TX (US);

Yaping Zhou, Austin, TX (US);

Inventors:

Paul M. Harvey, Austin, TX (US);

Colm B. O'Reilly, Austin, TX (US);

Samuel W. Yang, Austin, TX (US);

Yaping Zhou, Austin, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.


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