Colm Brian O'Reilly is a prominent inventor based in Austin, TX (US). He has made significant contributions to the field of technology, particularly in the area of coreless package connections. With a total of 11 patents to his name, O'Reilly continues to push the boundaries of innovation.

Latest Patents

One of his latest patents is a system designed to improve coreless package connections. This innovative system includes ball grid array pads and a ball grid array. Additionally, it features connection members of the ball grid array that are conductively connected to their respective ball grid array pads. To enhance the performance, the system incorporates magnetic underfill positioned adjacent to some of the connection members and respective ball grid array pads, which increases the inductance of the connection members.

Career Highlights

Colm Brian O'Reilly has had a successful career, working at International Business Machines Corporation (IBM). His work has been instrumental in advancing technology in his field. O'Reilly's expertise and innovative mindset have led to numerous advancements in coreless package connections.

Collaborations

Throughout his career, O'Reilly has collaborated with notable colleagues, including Anand Haridass and Roger Donell Weekly. These collaborations have further enriched his work and contributed to the success of his projects.

Conclusion

Colm Brian O'Reilly is a distinguished inventor whose work in coreless package connections has made a significant impact in the technology sector. His innovative patents and collaborations highlight his dedication to advancing technology.

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