International Business Machines Corporation

Colm Brian O'Reilly

Anand Haridass

Roger Donell Weekly

Andreas Huber

Daniel Douriet

Bao G Truong

Paul Marian Harvey

Yaping Zhou

Samuel Wynne Yang

Bao Gia-Harvey Truong

A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.

System to improve coreless package connections

A computer program product is provided for power delivery analysis and design for a hierarchical system. The product includes a storage medium, readable by a processing circuit, for storing instructions for execution by the processing circuit for facilitating a method. The method includes building a model corresponding to each element of the hierarchical system, and compiling a repository that contains models corresponding to each element, where the repository includes a net list, a domain list, a component list, a pin list, and a layer list. The method also includes performing optimized gridding for each element, the net list, the domain list, the component list, the pin list, and the layer list; assembling a system model from the models contained in the repository; flattening the system model by converting the system model to a flattened system model that consists entirely of resistors; and running a simulation on the flattened system model.

Power delivery analysis and design

A circuit for detecting noise events in a system with time variable operating points is provided. A first voltage, which is averaged over time, is compared to a second voltage. A signal is generated to instruct circuits within a processor to initiate actions to keep a voltage from drooping further.

Method for detecting noise events in systems with time variable operating points

A circuit and a method for detecting noise events in a system with time variable operating points is provided. A switched capacitor filter comprising a plurality of capacitor units, samples a first voltage to determine an average of a set of voltage measurements, forming an average voltage. A filter control unit controls the plurality of capacitor units in the switched capacitor filter. A comparing unit compares the average voltage to the first voltage to form a comparison. A signaling unit generates a signal to instruct circuits in a processor to initiate actions to keep the first voltage from drooping below a threshold level in response to the comparison.

Statistical switched capacitor droop sensor for application in power distribution noise mitigation

The illustrative embodiments described herein provide an apparatus and method for facilitating signal transmission using differential transmission lines. The apparatus includes a first differential transmission line. The first differential transmission line includes a first plurality of conductors. The first plurality of conductors includes a set of conductors. The apparatus also includes a second differential transmission line. The second differential transmission line includes a second plurality of conductors. The second plurality of conductors includes a first conductor and a second conductor. A first noise produced by the first conductor on the set of conductors is balanced by a second noise produced by the second conductor on the set of conductors. The first differential transmission line and the second differential transmission line facilitate signal transmission.

Method and apparatus for facilitating signal transmission using differential transmission lines

A low inductance via arrangement for multilayer ceramic (MLC) substrates is provided. With the MLC substrate and via arrangement of the illustrative embodiments, the via-field inductance for a given contact pad array is reduced. This reduction is achieved by the introduction of T-jogs and additional vias. These T-jogs and additional vias form additional current paths that cause additional parallel inductances that reduce the via-field inductance. In one illustrative embodiment, the additional T-jogs and vias are added to a center portion of a contact pad array. The T-jogs are comprised of two jogs in a wiring layer of the MLC, each jog being toward a via associated with an adjacent contact pad in the contact pad array. These additional T-jogs and vias form additional current loops parallel to the existing ones which thus, reduce the total inductance of the via-field.

Fabricating substrates having low inductance via arrangements

A system for mitigating power supply and power distribution system noise response by throttling execution units based upon voltage sensing in a circuit is provided. A sensing unit senses the voltage of a circuit. The sensing unit determines if the execution of another execution unit will cause the circuit voltage to drop below a threshold level. In response to a determination that the execution of another execution unit will cause the circuit voltage to drop below the threshold level, the execution unit is throttled.

Mitigate power supply noise response by throttling execution units based upon voltage sensing

An apparatus and method are provided for monitoring the voltage available in each domain of multiple voltage domains of a partitioned electronic chip. The apparatus comprises a single conductive link coupled to the chip, and further comprises a domain selection network having a single output and a plurality of switchable inputs, the output being connected to the single conductive link, and two inputs being connected to monitor respective voltage levels of two of the plurality of voltage domains. A control mechanism is disposed to operate the selection network, in order to selectively connect one of the inputs to the single conductive link, and a sensor device external to the electronic chip is connected to measure the monitored respective voltage levels of two of the plurality of voltage domains using the single conductive link.

Apparatus and method for selectively monitoring multiple voltages in an IC or other electronic chip

A method is provided for power delivery analysis and design for a hierarchical system. The method includes building a model corresponding to each element of the hierarchical system, compiling a repository that contains the models corresponding to each element of the hierarchical system, where the repository includes a net list, a domain list, a component list, a pin list, and a layer list. The method further includes performing optimized gridding for each element of the hierarchial system, the net list, the domain list, the component list, the pin list, and the layer list and assembling a system model from the models contained in the repository. Also, the method includes flattening the system model by converting the system model to a flattened system model that consists entirely of resistors, and running a simulation on the flattened system model.

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Austin, TX, United States of America

Colm Brian O'Reilly