Yaping Zhou

USPTO Granted Patents = 14 (Patent Applications = 1)

Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 149(Granted Patents)

Location History:

Austin, TX (US) (2005 - 2014)
Sunnyvale, CA (US) (2012 - 2014)

Company Filing History:

9 out of 164,108

International Business Machines Corporation

patents

5 out of 5,491

Freescale Semiconductor,inc.

patents

Years Active: 2005-2014

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14 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8791372 - Reducing impedance discontinuity in packages (2014-07-29),

2. 8742565 - Ball grid array with improved single-ended and differential signal performance (2014-06-03),

3. 8440917 - Method and apparatus to reduce impedance discontinuity in packages (2013-05-14),

4. 8399981 - Ball grid array with improved single-ended and differential signal performance (2013-03-19),

5. 8338949 - System to improve coreless package connections (2012-12-25),

6. 8338948 - Ball grid array with improved single-ended and differential signal performance (2012-12-25),

7. 8222739 - System to improve coreless package connections (2012-07-17),

8. 8193800 - Voltage controlled on-chip decoupling capacitance to mitigate power supply noise (2012-06-05),

9. 7256488 - Semiconductor package with crossing conductor assembly and method of manufacture (2007-08-14),

10. 7203608 - Impedane measurement of chip, package, and board power supply system using pseudo impulse response (2007-04-10),

11. 7049694 - Semiconductor package with crossing conductor assembly and method of manufacture (2006-05-23),

12. 6998952 - Inductive device including bond wires (2006-02-14),

13. 6992377 - Semiconductor package with crossing conductor assembly and method of manufacture (2006-01-31),

14. 6933599 - Electromagnetic noise shielding in semiconductor packages using caged interconnect structures (2005-08-23),

Title: The Inventive Genius of Yaping Zhou

Introduction

Yaping Zhou is an influential inventor based in Austin, TX, known for his significant contributions to the field of electrical engineering and electronics. With 14 patents to his name, Zhou has made strides in developing innovative solutions that address critical issues in electronic packaging and semiconductor technology.

Latest Patents

Yaping Zhou's latest patents showcase his expertise in reducing impedance discontinuity in electronic packages. One of his notable inventions is a device featuring plated through holes (PTHs) designed to minimize impedance discontinuity. This technology incorporates PTH vias embedded within a core layer of printed circuit boards, enhanced by magnetic coatings, such as nickel, to boost conductance.

Another recent innovation is an improved ball grid array system that optimizes single-ended and differential signal performance. This creation implements a hexagonal pattern for pin assignments in semiconductor packages, cleverly utilizing nested hexagonal arrangements to enhance efficiency and performance.

Career Highlights

Throughout his career, Yaping Zhou has worked with leading technology firms, including International Business Machines Corporation (IBM) and Freescale Semiconductor, Inc. His experience in these organizations has allowed him to develop cutting-edge technologies that influence modern electronics.

Collaborations

Zhou has collaborated with several talented individuals in the field, including Paul Marian Harvey and Chu-Chung Lee. Their teamwork has contributed to advancing their shared goals of innovation in electronics and producing patented technologies that push industry standards forward.

Conclusion

Yaping Zhou exemplifies the spirit of innovation through his numerous patents and collaborations. His work not only advances the field of electrical engineering but also impacts the larger technology landscape, making him a prominent figure in the domain of inventions and innovations.

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1 patent pending:

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