The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Jun. 16, 2006
Makoto Aikawa, Tokyo, JP;
Sang Hoo Dhong, Austin, TX (US);
Brian Flachs, Georgetown, TX (US);
Paul Marlan Harvey, Austin, TX (US);
Brad William Michael, Cedar Park, TX (US);
Yaping Zhou, Austin, TX (US);
Makoto Aikawa, Tokyo, JP;
Sang Hoo Dhong, Austin, TX (US);
Brian Flachs, Georgetown, TX (US);
Paul Marlan Harvey, Austin, TX (US);
Brad William Michael, Cedar Park, TX (US);
Yaping Zhou, Austin, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for measuring impedance of a microprocessor chip, electronic packaging, and circuit board power supply system by generating a pseudo-impulse current having a width size in the time domain not larger than the inversion of a maximum frequency of interest and obtaining a voltage measurement in a frequency domain of the pseudo-impulse current. The mechanism of the present invention then predicts the normalized Fourier transformation of the current in the frequency domain, wherein the normalized Fourier transformation depends upon a switching charge of the pseudo-impulse current, measures the switching charge of the pseudo-impulse current, obtains a first current measurement at zero frequency using the measured switching charge, and obtains a second current measurement at a frequency of interest using the first current measurement. The mechanism of the present invention then calculates the impedance of the chip/package/board power supply system using the voltage measurement and the second current measurement.