Paul Marlan Harvey

This inventor holds 8 USPTO granted patents and 1 published patent application. Top assignees: International Business Machines Corporation, 3M Innovative Properties Company. Active years: 1998-2012.

USPTO Granted Patents = 8 (Patent Applications = 1)

% Patents Active = 37.5

Average Co-Inventor Count = 1.1

ph-index = 4

Forward Citations = 108(Granted Patents)

Company Filing History:

6 out of 166,325

International Business Machines Corporation

patents

2 out of 22,379

3M Innovative Properties Company

patents

Years Active: 1998-2012

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8153516 - Method of ball grid array package construction with raised solder ball pads (2012-04-10),

2. 7816754 - Ball grid array package construction with raised solder ball pads (2010-10-19),

3. 7253510 - Ball grid array package construction with raised solder ball pads (2007-08-07),

4. 7203608 - Impedane measurement of chip, package, and board power supply system using pseudo impulse response (2007-04-10),

5. 6876088 - Flex-based IC package construction employing a balanced lamination (2005-04-05),

6. 6867121 - Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction (2005-03-15),

7. 6153508 - Multi-layer circuit having a via matrix interlayer connection and method (2000-11-28),

8. 5753976 - Multi-layer circuit having a via matrix interlayer connection (1998-05-19),

Profile summary based on public USPTO records.

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1 patent pending:

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