The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Dec. 05, 2003
Yaping Zhou, Austin, TX (US);
Susan H. Downey, Austin, TX (US);
Sheila F. Chopin, Austin, TX (US);
Tu-anh Tran, Austin, TX (US);
Alan H. Woosley, Austin, TX (US);
Peter R. Harper, Lucas, TX (US);
Perry H. Pelley, Iii, Austin, TX (US);
Yaping Zhou, Austin, TX (US);
Susan H. Downey, Austin, TX (US);
Sheila F. Chopin, Austin, TX (US);
Tu-Anh Tran, Austin, TX (US);
Alan H. Woosley, Austin, TX (US);
Peter R. Harper, Lucas, TX (US);
Perry H. Pelley, III, Austin, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An inductive device () is formed above a substrate () having a conductive coil formed around a core (). The coil comprises segments formed from a first plurality of bond wires () and a second plurality of bond wires (). The first plurality of bond wires () extends between the core () and the substrate (). Each of the first plurality of bond wires is coupled to two of a plurality of wire bond pads (). The second plurality of bond wires () extends over the core () and is coupled between two of the plurality of wire bond pads (). A shield () includes a portion that is positioned between the core () and the substrate ().