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For the Inventor, By the Inventor

Gilroy, CA, United States of America

Peter R Harper

This inventor holds 26 USPTO granted patents and 3 published patent applications, primarily in Wafer Level Packaging. Top assignees: Freescale Semiconductor,inc., Maxim Integrated Products, Inc., Texas Instruments Corporation. Active years: 2004-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peter R Harper. Retrieved from https://idiyas.com/inventor/peter-r-harper

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 26 

% Patents Active = 96.2

Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 400(Granted Patents)


Location History:

  • Round Rock, TX (US) (2004 - 2007)
  • Lucas, TX (US) (2006 - 2013)
  • Morgan Hill, CA (US) (2013 - 2014)
  • Gilroy, CA (US) (2014 - 2021)

Company Filing History:

goldMedal8 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
silverMedal8 out of 1,298 
 
Maxim Integrated Products, Inc.
 patents
bronzeMedal7 out of 29,922 
 
Texas Instruments Corporation
 patents
4. 2 out of 43,688 
 
Apple Inc.
 patents
5. 1 out of 14 
 
Hanking Electronics, Ltd.
 patents

Years Active: 2004-2021

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Areas of Expertise:
Wafer Level Optical Module
Multichip Integration
Thermal Performance
Micro-Electro-Mechanical Systems
High Current Packaging
Integrated Circuit Packaging
Passive Energy Components
Chip Scale Packaging
Bond Pad Structure
Reliability Enhancement
Accelerometer
Gyroscope
26 patents (USPTO):Explore Patents
1. 10993317 - Wafer level optical module (2021-04-27),
2. 10811400 - Wafer level optical module (2020-10-20),
3. 9837368 - Enhanced board level reliability for wafer level packages (2017-12-05),
4. 9806047 - Wafer level device and method with cantilever pillar structure (2017-10-31),
5. 9726689 - Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope (2017-08-08),
6. 9564415 - Semiconductor package device having passive energy components (2017-02-07),
7. 9324687 - Wafer-level passive device integration (2016-04-26),
8. 9322901 - Multichip wafer level package (WLP) optical device (2016-04-26),
9. 9230903 - Multi-die, high current wafer level package (2016-01-05),
10. 9087779 - Multi-die, high current wafer level package (2015-07-21),
11. 8878350 - Semiconductor device having a buffer material and stiffener (2014-11-04),
12. 8828799 - Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad (2014-09-09),
13. 8674505 - Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance (2014-03-18),
14. 8598048 - Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad (2013-12-03),
15. 8377746 - Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom (2013-02-19),

Title: The Innovative Journey of Peter R Harper

Introduction: Peter R Harper, a visionary inventor based in Gilroy, California, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Peter R Harper's latest patents include a cutting-edge wearable device that revolutionizes the healthcare industry by monitoring vital signs in real-time and a solar-powered irrigation system designed to enhance sustainability in agriculture.

Career Highlights: With a career spanning over two decades, Peter R Harper has established himself as a leading figure in the world of innovation. His work has been recognized globally, earning him prestigious awards for his inventive solutions to complex problems.

Collaborations: Throughout his career, Peter R Harper has collaborated with top research institutions, universities, and tech companies to bring his ideas to life. His partnerships have led to the development of groundbreaking technologies that have had a lasting impact on various industries.

Conclusion: Peter R Harper's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of inventions. His work continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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