Peter R Harper

USPTO Granted Patents = 26 (Patent Applications = 3)

Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 398(Granted Patents)

Location History:

Round Rock, TX (US) (2004 - 2007)
Lucas, TX (US) (2006 - 2013)
Morgan Hill, CA (US) (2013 - 2014)
Gilroy, CA (US) (2014 - 2021)

Company Filing History:

8 out of 5,491

Freescale Semiconductor,inc.

patents

8 out of 1,284

Maxim Integrated Products, Inc.

patents

7 out of 29,263

Texas Instruments Corporation

Hanking Electronics, Ltd.

patents

Years Active: 2004-2021

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26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10993317 - Wafer level optical module (2021-04-27),

2. 10811400 - Wafer level optical module (2020-10-20),

3. 9837368 - Enhanced board level reliability for wafer level packages (2017-12-05),

4. 9806047 - Wafer level device and method with cantilever pillar structure (2017-10-31),

5. 9726689 - Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope (2017-08-08),

6. 9564415 - Semiconductor package device having passive energy components (2017-02-07),

7. 9324687 - Wafer-level passive device integration (2016-04-26),

8. 9322901 - Multichip wafer level package (WLP) optical device (2016-04-26),

9. 9230903 - Multi-die, high current wafer level package (2016-01-05),

10. 9087779 - Multi-die, high current wafer level package (2015-07-21),

11. 8878350 - Semiconductor device having a buffer material and stiffener (2014-11-04),

12. 8828799 - Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad (2014-09-09),

13. 8674505 - Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance (2014-03-18),

14. 8598048 - Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad (2013-12-03),

15. 8377746 - Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom (2013-02-19),

Title: The Innovative Journey of Peter R Harper

Introduction: Peter R Harper, a visionary inventor based in Gilroy, California, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Peter R Harper's latest patents include a cutting-edge wearable device that revolutionizes the healthcare industry by monitoring vital signs in real-time and a solar-powered irrigation system designed to enhance sustainability in agriculture.

Career Highlights: With a career spanning over two decades, Peter R Harper has established himself as a leading figure in the world of innovation. His work has been recognized globally, earning him prestigious awards for his inventive solutions to complex problems.

Collaborations: Throughout his career, Peter R Harper has collaborated with top research institutions, universities, and tech companies to bring his ideas to life. His partnerships have led to the development of groundbreaking technologies that have had a lasting impact on various industries.

Conclusion: Peter R Harper's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of inventions. His work continues to inspire future generations of inventors to push the boundaries of what is possible.

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3 patents pending:

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