The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Apr. 04, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Yinjuan He, Cupertino, CA (US);

Karthik Shanmugam, Singapore, SG;

Peter R. Harper, Gilroy, CA (US);

Tongbi Tom Jiang, Santa Clara, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01); H01L 25/16 (2006.01); H01L 33/24 (2010.01); H01L 33/62 (2010.01); H01L 23/31 (2006.01); H01L 33/08 (2010.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 27/15 (2013.01); H01L 31/125 (2013.01); H01L 31/1892 (2013.01); H01L 33/0093 (2020.05); H01L 33/08 (2013.01); H01L 33/24 (2013.01); H01L 33/62 (2013.01);
Abstract

A method for manufacturing an optical wafer may include coating multiple optical components with a substrate. The multiple optical components may include a light emitting component and a light detecting component, and each of the optical components may include one or more electrical connections. The method may also include depositing a redistribution layer onto at least one of the electrical connections, wherein the redistribution layer routes the electrical connection within the optical wafer to an external connection. The method may also include depositing a passivation layer over the redistribution layer and depositing a dark photoresist layer on at least the passivation layer. The photoresist layer may operatively reduce optical interference between at least one light emitting component and at least one light detecting component.


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