Santa Clara, CA, United States of America

Tongbi T Jiang

This inventor holds 316 USPTO granted patents and 13 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging (CPC class H01L2-144). Top assignees: Micron Technology Incorporated, Apple Inc., Aptina Imaging Corporation. Active years: 1999-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tongbi T Jiang. Retrieved from https://idiyas.com/inventor/tongbi-t-jiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 316 

% Patents Active = 79.7

 

Average Co-Inventor Count = 2.0

ph-index = 33

Forward Citations = 4,397(Granted Patents)

Forward Citations (Not Self Cited) = 4,134(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Cupertino, CA (US) (2017)
  • Boise, ID (US) (1999 - 2018)
  • Santa Clara, CA (US) (2016 - 2024)

Company Filing History:


Years Active: 1999-2026

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Areas of Expertise:
Semiconductor Packaging
Stacked Interconnects
VCSEL Structures
MEMS Devices
Optoelectronic Devices
Light-Emitting Diodes
Integrated Circuits
Sensor Packages
Microelectronic Devices
Fluid-Based Sensing
Optical Modules
Conductive Vias
316 patents (USPTO):Explore Patents

Title: Tongbi Jiang: Pioneering Inventor with 303 Patents

Introduction:

The world of innovation and patents has been greatly influenced by the groundbreaking work of Tongbi Jiang. Based in Boise, ID (US), Jiang has made significant contributions to the field through his numerous patents and inventive spirit. This article explores some of his latest patents, career highlights, collaborations, and the indelible mark he has left on the industry.

Latest Patents:

Tongbi Jiang's latest patents demonstrate his ingenuity and foresight in addressing vital technological challenges. One such patent, "Exposed wire-bonding for sensing liquid and water in electronic devices," focuses on enhancing the performance and reliability of electronic devices in detecting moisture. This innovation has implications for improving the durability and safety of electronic devices in various environments.

Another recent patent by Jiang, "Packaged integrated circuit devices with through-body conductive vias, and methods of making same," tackles the integration of conductive vias in integrated circuit devices. Such conductive vias enable improved connectivity and signal transmission, opening up new possibilities for miniaturization and circuit design.

Career Highlights:

Tongbi Jiang's remarkable career boasts an impressive total of 303 patents. He has actively contributed to high-profile companies, including Micron Technology Incorporated and Apple Inc. Jiang's innovative solutions have helped shape the future of the technology industry and have undoubtedly brought significant advancements in various domains.

Collaborations:

Throughout his illustrious career, Tongbi Jiang has collaborated with esteemed professionals, further expanding the impact of his inventions. Notable coworkers who have joined forces with Jiang include Chad A Cobbley and John E Vannortwick. These collaborations have fostered a rich innovation ecosystem, empowering individuals to exchange ideas, challenge boundaries, and push technological boundaries even further.

Conclusion:

Tongbi Jiang's influence on the world of inventions, innovations, and patents is undeniable. With an exemplary record of 303 patents and his recent groundbreaking work, Jiang has proven to be a pioneer in his field. His dedication to improving electronic devices' functionality and reliability has led to notable advancements. As Tongbi Jiang's inventive journey continues, we can only anticipate more game-changing contributions from this visionary inventor.

Please note that all the information provided is based on the given data and may not include the complete scope of Tongbi Jiang's achievements. For more detailed and accurate information, refer to official patent databases or authorized sources.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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