The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2022
Filed:
Aug. 21, 2018
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Young Do Kweon, Boise, ID (US);
Tongbi Jiang, Santa Clara, CA (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/544 (2006.01); H01L 23/498 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/742 (2013.01); H01L 21/4853 (2013.01); H01L 21/566 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/49816 (2013.01); H01L 23/544 (2013.01); H01L 24/11 (2013.01); H01L 24/12 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/18 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 21/563 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/05001 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/11015 (2013.01); H01L 2224/1183 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16 (2013.01); H01L 2224/274 (2013.01); H01L 2224/7598 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/384 (2013.01);
Abstract
Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.