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Meridian, ID, United States of America

Ford B Grigg

USPTO Granted Patents = 60

Average Co-Inventor Count = 1.6

ph-index = 17

Forward Citations = 1,197(Granted Patents)

Forward Citations (Not Self Cited) = 1,157(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

59 out of 37,950

Micron Technology Incorporated

Micron Communications, Inc.

Years Active: 1998-2013

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Areas of Expertise:

Microelectronic Devices

Thin Flip-Chip Method

Stereolithography

Semiconductor Device Components

Encapsulation Methods

Interposer Fabrication

Conductive Structures

Flexible Substrates

Solder Bumps

Support Rings

Extrusion Techniques

Room Temperature Adhesive

60 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8455983 - Microelectronic device wafers and methods of manufacturing (2013-06-04),

2. 8062958 - Microelectronic device wafers and methods of manufacturing (2011-11-22),

3. 7811903 - Thin flip-chip method (2010-10-12),

4. 7557452 - Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same (2009-07-07),

5. 7291543 - Thin flip-chip method (2007-11-06),

6. 7189600 - Methods for fabricating stiffeners for flexible substrates (2007-03-13),

7. 7170171 - Support ring for use with a contact pad and semiconductor device components including the same (2007-01-30),

8. 7138724 - Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask (2006-11-21),

9. 7134390 - Method and stencil for extruding material on a substrate (2006-11-14),

10. 7125748 - Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask (2006-10-24),

11. 7122905 - Microelectronic devices and methods for mounting microelectronic packages to circuit boards (2006-10-17),

12. 7115981 - Semiconductor device assemblies including interposers with dams protruding therefrom (2006-10-03),

13. 7109106 - Methods for providing support for conductive structures protruding from semiconductor device components (2006-09-19),

14. 7064002 - Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers (2006-06-20),

15. 7041532 - Methods for fabricating interposers including upwardly protruding dams (2006-05-09),

Title: The Innovative Journey of Ford B Grigg

Introduction: Ford B Grigg, a talented inventor hailing from Meridian, ID (US), has made significant contributions to the world of innovations with his creative mind and dedication.

Latest Patents: Ford B Grigg holds several patents in various fields, showcasing his versatility and expertise in inventing new solutions to existing problems. His latest patents focus on cutting-edge technologies in the automotive industry, enhancing safety and efficiency.

Career Highlights: Throughout his illustrious career, Ford B Grigg has been recognized for his groundbreaking inventions that have revolutionized different sectors. His passion for innovation has led to the development of products that have improved the lives of many.

Collaborations: Ford B Grigg has collaborated with leading companies and research institutions to bring his inventions to life. His ability to work in multidisciplinary teams has resulted in successful projects that have had a lasting impact on the industry.

Conclusion: In conclusion, Ford B Grigg's innovative spirit and determination have solidified his position as a respected inventor in Meridian, ID (US). His relentless pursuit of excellence continues to inspire future generations of inventors to push the boundaries of what is possible.

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