The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Jul. 15, 2003
Ford B. Grigg, Meridian, ID (US);
Ford B. Grigg, Meridian, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can include a die, an interposer substrate, a solder-ball, and a dielectric compound. The die can have an integrated circuit and at least one bond-pad coupled to the integrated circuit. The interposer substrate is coupled to the die and can have at least one ball-pad electrically coupled to the bond-pad on the die. The interposer substrate can also have a trace line adjacent to the ball-pad, and a solder-mask having an opening over the ball-pad. The solder-ball can contact the ball-pad in the opening. The dielectric compound can insulate the ball-pad and the solder-ball from an exposed portion of the adjacent trace line in the opening.