The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Sep. 13, 2021
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Saijin Liu, San Jose, CA (US);

Tongbi T. Jiang, Santa Clara, CA (US);

Saahil Mehra, Saratoga, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/167 (2006.01); A61B 5/00 (2006.01); G04C 10/00 (2006.01); G04G 21/02 (2010.01); G06F 1/16 (2006.01); H02J 50/10 (2016.01);
U.S. Cl.
CPC ...
H01L 31/167 (2013.01); A61B 5/0059 (2013.01); A61B 5/681 (2013.01); G04C 10/00 (2013.01); G04G 21/025 (2013.01); G06F 1/163 (2013.01); H02J 50/10 (2016.02);
Abstract

An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.


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