Micron Technology Incorporated

Apple Inc.

Other

Aptina Imaging Corporation

Micron Semiconductor, Inc.

Micro Technology, Inc.

Mcron Technology, Inc.

Tongbi T Jiang

Chad A Cobbley

John VanNortwick

Bret K Street

Syed Sajid Ahmad

Walter L Moden

Li Li

Jerrold L King

Edward A Schrock

Michael E Connell

Zhiqiang (Jeff) Wu

Jin Li

Shijian Luo

Mike Connell

Warren M Farnworth

Alan G Wood

David Y Kao

Setho Sing Fee

Gregory M Chapman

Lim Thiam Chye

J Michael Brooks

Young Do Kweon

Zhiping Yin

Yong Poo Chia

Caleb C Han

W Jeff Reeder

Salman Akram

Jun Zhai

Ed A Schrock

Casey L Prindiville

Jason L Fuller

Curtis Hollingshead

David J Corisis

Xiaofeng Fan

Tsuyoshi Yamashita

Whonchee Lee

Frank L Hall

Weiping Li

Tay Wuu Yean

Jie-Hua Zhao

Brenton L Dickey

Zhigiang (Jeff) Wu

Saijin Liu

Farrah J Johnson

William Mark Hiatt

Jaspreet Singh Gandhi

Brad G Boozer

Mark S Johnson

Peter George Hartwell

Peter R Harper

Zhong-Yi Xia

James G Horiuchi

J Mike Brooks

Patrick E O'Brien

David MacNeil

William Scott Lee

S Derek Hinkle

Ashwin Balasubramanian

Karthik Shanmugam

Farrah J Storli

Saahil Mehra

Yinjuan He

John E Vannortwick

Yong Du

Partrick Tandy

Casey L Prindivill

Sandhya Sandireddy

Wei Chen

Matthew Emanuel Last

Manoj K Bhattacharyya

John O Jacobson

Chia Yong Poo

Lili Huang

Savas Gider

Rongsheng Yang

Jiahui Liang

Mathieu Charbonneau-Lefort

Miaolei Yan

Seung Jae Hong

Gregory B Arndt

John C Fernandez

Yun X Ma

Ralph E Kauffman

Roham Solasi

Mark G Walsh

A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

Semiconductor components having conductive vias with aligned back side conductors

Embodiments are directed to a blood pressure measurement device that includes a strap configured to couple the blood pressure measurement device to a user, an air pump coupled to the strap and having a housing defining a surface facing the user, and an inflatable chamber positioned on the surface of the air pump and fluidly coupled to the air pump. The inflatable chamber can be positioned between the air pump and the user when the blood pressure measurement device is worn by the user and expand towards the user when inflated. The blood pressure measurement device can also include a pressure sensing chamber coupled to the inflatable chamber and positioned between the inflatable chamber and the user when the blood pressure measurement device is worn by the user. The pressure sensing chamber can include a liquid volume and a pressure sensing device configured to detect a pressure of the liquid volume.

Blood pressure monitoring system including a liquid filled sensor

A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.

Optical sensor package with magnetic component for device attachment

An embodiment of a barrier assembly includes a housing having an aperture and a magnet at least partially disposed within the housing. A first surface of the magnet is exposed. The barrier assembly also includes a light-emitting component disposed within the aperture. Another embodiment of a barrier assembly includes a housing having a plurality of apertures formed about a perimeter of the housing. The barrier assembly also includes a magnet at least partially embedded within the housing and the magnet includes an opening formed through a center of the magnet and a plurality of light-emitting components, each light-emitting component at least partially disposed within a corresponding aperture of the plurality of apertures.

Systems and methods for magnetic barrier assembly

An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.

Optoelectronic devices with non-rectangular die shapes

An electronic device, such as a smart watch, incorporating a fluid-based pressure-sensing device is disclosed. The fluid-based pressure-sensing device includes an enclosure, a pressure sensor, a diaphragm and a sensing medium. The enclosure includes an opening and the pressure sensor is disposed inside the enclosure. The diaphragm hermetically seals the opening, and the sensing medium transfers a pressure exerted on the diaphragm to the pressure sensor. The sensing medium can be liquid oil filling a space of the enclosure, and the diaphragm is a polymer material. The pressure-sensing device may sense an environmental pressure, which may be used by the electronic device to modify its operations, change information that is displayed, and so on.

Wearable electronic device with fluid-based pressure sensing

An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor affixed to a die disposed in the sensor volume, and an exposed moisture detection conductor positioned in the sensor volume.

Exposed wire-bonding for sensing liquid and water in electronic devices

Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.

Edge-mountable semiconductor chip package

An optical module may be formed on a wafer. The wafer may include a substrate and one or more optical components encapsulated, at least partially, by the substrate. Each of the optical components are configured to emit or sense light. The wafer may also include one or more printed circuit board (PCB) bars encapsulated, at least partially, by the substrate allowing electrical conductivity from a first side of the substrate to a second side of the substrate. The wafer may also include at least one redistribution layer to electrically couple at least one of the optical components to at least one of the PCB bars.

Wafer level optical module

A method for manufacturing an optical wafer may include coating multiple optical components with a substrate. The multiple optical components may include a light emitting component and a light detecting component, and each of the optical components may include one or more electrical connections. The method may also include depositing a redistribution layer onto at least one of the electrical connections, wherein the redistribution layer routes the electrical connection within the optical wafer to an external connection. The method may also include depositing a passivation layer over the redistribution layer and depositing a dark photoresist layer on at least the passivation layer. The photoresist layer may operatively reduce optical interference between at least one light emitting component and at least one light detecting component.

Growing community of inventors

Santa Clara, CA, United States of America

Tongbi T Jiang