For the Inventor, By the Inventor

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Boise, ID, United States of America

Micron Semiconductor, Inc.

USPTO Granted Patents = 156

Forward Citations = 7,496

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112 inventors (with patents filed for the assignee):

Gurtej S Sandhu (20 out of 1,435 patents)

Randhir P Thakur (12 out of 175 patents)

Charles H Dennison (10 out of 290 patents)

4. Trung Tri Doan (9 out of 434 patents)

5. Monte Manning (9 out of 156 patents)

6. Guy T Blalock (6 out of 187 patents)

7. Tyler A Lowrey (6 out of 326 patents)

8. Annette L Martin (6 out of 17 patents)

9. Pierre C Fazan (6 out of 185 patents)

10. Stephen L Casper (5 out of 145 patents)

11. David J Keller (5 out of 40 patents)

12. Viju K Mathews (5 out of 46 patents)

13. Paul S Zagar (5 out of 56 patents)

14. Fernando N Gonzalez (5 out of 310 patents)

15. Donald L Westmoreland (4 out of 65 patents)

Core Competencies:

Photoemission Etching

Ultrasonic Wire Bonding

DRAM Capacitor Manufacturing

HSG Rugged Capacitor

Row Decoder Circuit

Polysilicon Contacts

High Speed Global Redundancy

Wafer Edge Heat Compensation

Floating Gate Memory

Chemical Vapor Deposition

Programmable Logic Devices

Current Leakage Reduction

156 patents: Sort by Forward Citations

1. 6312557 - Method and apparatus for using photoemission to determine the endpoint of an etch process (2001-11-06),

2. 6244498 - Ultrasonic vibration mode for wire bonding (2001-06-12),

3. 5763286 - Process for manufacturing a DRAM capacitor having an annularly-grooved, (1998-06-09),

4. 5696014 - Method for increasing capacitance of an HSG rugged capacitor using a (1997-12-09),

5. 5636175 - Row decoder/driver circuit for determining non selected wordlines and (1997-06-03),

6. 5541137 - Method of forming improved contacts from polysilicon to silicon or other (1996-07-30),

7. 5528539 - High speed global row redundancy system (1996-06-18),

8. 5504831 - System for compensating against wafer edge heat loss in rapid thermal (1996-04-02),

9. 5496775 - Semiconductor device having ball-bonded pads (1996-03-05),

10. 5496762 - Highly resistive structures for integrated circuits and method of (1996-03-05),

11. 5494841 - Split-polysilicon CMOS process for multi-megabit dynamic memories (1996-02-27),

12. 5492853 - Method of forming a contact using a trench and an insulation layer (1996-02-20),

13. 5492597 - Method of etching WSi.sub.x films (1996-02-20),

14. 5484314 - Micro-pillar fabrication utilizing a stereolithographic printing process (1996-01-16),

15. 5469393 - Circuit and method for decreasing the cell margin during a test mode (1995-11-21),

Micron Semiconductor, Inc. is a global leader in the semiconductor industry, providing innovative solutions for a wide range of applications, including data storage, memory, and computing. With a strong focus on research and development, Micron is constantly pushing the boundaries of technology to deliver cutting-edge products to its customers around the world.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

156 Patents

#4 in Boise, ID

#5 in Idaho

#2,457 in US

#5,117 in the World

Boise, ID, United States of America

Micron Semiconductor, Inc.

Forward Citations = 7,496

112 inventors:

Gurtej S Sandhu (20 out of 1,435 patents)

Randhir P Thakur (12 out of 175 patents)

Charles H Dennison (10 out of 290 patents)

4. Trung Tri Doan (9 out of 434 patents)

5. Monte Manning (9 out of 156 patents)

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