Susan H Downey

Title: Susan H Downey: Innovator in Interconnect Structures

Introduction

Susan H Downey is a prominent inventor based in Austin, TX (US). She has made significant contributions to the field of interconnect structures, holding a total of 11 patents. Her innovative work focuses on enhancing the structural support of interconnect pads while allowing for effective signal conductance.

Latest Patents

One of her latest patents is titled "Method and apparatus for providing structural support for interconnect pad while allowing signal conductance." This method provides an interconnect structure that has enhanced structural support when the underlying functional metal layers are insulated with a low modulus dielectric. The design includes a first metal layer with multiple openings that overlies the substrate, followed by an electrically insulating layer and a second metal layer, which also has openings. An interconnect pad is positioned over the second metal layer, with a specific alignment of openings in the two metal layers to improve the structural strength of the interconnect structure. The alignment may vary based on the application and materials used, and it can incorporate bond wire connections or conductive bumps.

Career Highlights

Throughout her career, Susan has worked with notable companies such as Freescale Semiconductor, Inc. and Motorola Corporation. Her experience in these organizations has allowed her to develop and refine her innovative ideas in the field of interconnect technology.

Collaborations

Some of her coworkers include James W Miller and Peter R Harper. Their collaboration has contributed to the advancement of technology in their respective fields.

Conclusion

Susan H Downey is a remarkable inventor whose work in interconnect structures has paved the way for advancements in technology. Her patents reflect her dedication to innovation and her impact on the industry is significant.