Austin, TX, United States of America

Tu-Anh N Tran

This inventor holds 19 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc.. Active years: 2005-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tu-Anh N Tran. Retrieved from https://idiyas.com/inventor/tu-anh-n-tran

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 89.5

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 219(Granted Patents)


Company Filing History:


Years Active: 2005-2019

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Areas of Expertise:
Wirebonding
Semiconductor Devices
Electronic Component Package
Bond Pads
Corrosion Reduction
Integrated Circuit
Coated Bonding Wire
Voltage Distributor
Copper Ball Bond
Power Lead-On-Chip
Inductive Device
Testing Structures
19 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Tu-Anh N Tran: A Look at His Patents and Career

Introduction: Tu-Anh N Tran, located in Austin, TX, is an accomplished inventor with an impressive portfolio of 19 patents. His contributions to the field of semiconductor technology through innovative methods and structures have had a significant impact on the industry.

Latest Patents: Among his latest patents is a notable invention focused on surface finish for wire bonding. This patent outlines a method for creating package devices for a semiconductor die, featuring a die mounting structure with a copper bond pad and a cobalt-containing layer. The design ensures that the cobalt-containing material is strategically placed under the wire bond structure to enhance reliability. Another significant patent addresses methods for forming semiconductor devices with stepped bond pads, which involves designing a bond pad with varied thicknesses to optimize performance in semiconductor structures.

Career Highlights: Tu-Anh has built a robust career at prominent companies such as Freescale Semiconductor, Inc., and NXP USA, Inc. His experiences in these organizations have provided him with the platform to innovate and excel in semiconductor design and fabrication, contributing to advancements in the field.

Collaborations: Throughout his career, Tu-Anh N Tran has collaborated with esteemed colleagues such as Chu-Chung Lee and Burton Jesse Carpenter, further enriching his work and expanding the horizons of his innovative projects. These collaborations exemplify the collective effort and support within the research community that drives impactful technological advancements.

Conclusion: Tu-Anh N Tran's contributions to the semiconductor industry through his patents and collaboration with others underscore his role as a key innovator. His work not only enhances current technologies but also paves the way for future innovations in semiconductor device manufacturing. As he continues to explore new frontiers, his legacy is likely to inspire new generations of inventors and researchers in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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