The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Apr. 25, 2014
Applicants:
Burton J. Carpenter, Austin, TX (US);
Chu-chung Lee, Round Rock, TX (US);
Tu-anh N. Tran, Austin, TX (US);
Inventors:
Burton J. Carpenter, Austin, TX (US);
Chu-Chung Lee, Round Rock, TX (US);
Tu-Anh N. Tran, Austin, TX (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 24/05 (2013.01); H01L 24/43 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/431 (2013.01); H01L 2224/432 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/45687 (2013.01); H01L 2224/4845 (2013.01); H01L 2224/85444 (2013.01);
Abstract
A semiconductor structure includes a bond pad and a wire bond coupled to the bond pad. The wire bond includes a bond in contact with the bond pad. The wire bond includes a coating on a surface of the wire bond, and a first exposed portion of the wire bond in a selected location. The wire bond is devoid of the coating over the selected location of the wire bond, and an area of the first exposed portion is at least one square micron.