This inventor holds 32 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc.. Active years: 2005-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005-2026
Areas of Expertise:
Title: Innovations by Chu-Chung Lee: A Leader in Semiconductor Patents
Introduction
Chu-Chung Lee, an accomplished inventor based in Round Rock, TX, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 31 patents, he has established himself as a key figure in the innovation landscape.
Latest Patents
Among his latest contributions, Lee has developed a patent titled "Surface finish for wirebonding." This innovation presents a die mounting structure that features a finished bond pad composed of a copper bond pad with a cobalt-containing layer on its surface. This design strategically places cobalt-containing material between the wire bond structure and the copper bond pad, enhancing the reliability and performance of semiconductor devices. Another notable patent is "Copper ball bond features and structure," which details an integrated circuit wire bond connection. This patent describes a sophisticated bonding method where an aluminum bond pad is directly bonded to a copper ball, forming an aluminum splash structure that is characterized by various geometric properties, ensuring robust copper ball bonds.
Career Highlights
Chu-Chung Lee has held pivotal roles in renowned companies such as Freescale Semiconductor, Inc. and NXP USA, Inc. His work in these organizations has been crucial in advancing semiconductor technologies and establishing high standards for reliability in wire bonding processes.
Collaborations
Throughout his career, Lee has collaborated with esteemed colleagues, including Kevin John Hess and Tu-Anh N Tran. These partnerships have fostered innovation and contributed to the successful development of his patented technologies.
Conclusion
Chu-Chung Lee's extensive patent portfolio and his commitment to innovation have positioned him as a leader in semiconductor technology. His latest advancements in wire bonding techniques continue to push the boundaries of what is possible in the field, ensuring reliable connections in electronic devices. His work not only exemplifies individual brilliance but also highlights the importance of collaboration in driving technological progress.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile