The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Nov. 26, 2013
Freescale Semiconductor, Inc., Austin, TX (US);
Tu-Anh N. Tran, Austin, TX (US);
John G. Arthur, Austin, TX (US);
Yin Kheng Au, Petaling Jaya, MY;
Chu-Chung Lee, Round Rock, TX (US);
Chin Teck Siong, Shah Alam, MY;
Meijiang Song, Tianjin, CN;
Jia Lin Yap, Klang, MY;
Matthew J. Zapico, Cedar Park, TX (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
An integrated circuit copper wire bond connection is provided having a copper ball () bonded directly to an aluminum bond pad () formed on a low-k dielectric layer () to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location () under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.