Matthew J Zapico

Title: The Innovations of Matthew J Zapico

Introduction

Matthew J Zapico is an accomplished inventor based in Cedar Park, TX (US). He has made significant contributions to the field of integrated circuits, particularly through his innovative patent related to copper wire bond connections. His work has implications for enhancing the reliability of electronic devices.

Latest Patents

Matthew J Zapico holds a patent for a "Copper ball bond interface structure and formation." This invention provides an integrated circuit copper wire bond connection that features a copper ball bonded directly to an aluminum bond pad. The bond interface structure is characterized by a first plurality of geometric features designed to improve thermal cycling reliability. Notably, it includes an aluminum minima feature located at an outer peripheral location under the copper ball, which helps prevent the formation and propagation of cracks in the aluminum bond pad.

Career Highlights

Matthew is currently employed at Freescale Semiconductor, Inc., where he continues to innovate and contribute to advancements in semiconductor technology. His expertise in integrated circuits has positioned him as a valuable asset in his field.

Collaborations

Throughout his career, Matthew has collaborated with notable colleagues, including Tu-Anh N Tran and John G Arthur. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Matthew J Zapico's contributions to the field of integrated circuits through his patent and work at Freescale Semiconductor, Inc. highlight his role as a significant inventor in the technology sector. His innovations continue to impact the reliability and performance of electronic devices.