The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Oct. 31, 2014
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventors:
Chu-Chung Lee, Round Rock, TX (US);
Burton J. Carpenter, Austin, TX (US);
Tu-Anh N. Tran, Austin, TX (US);
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 23/3107 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/4555 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/45573 (2013.01); H01L 2224/45618 (2013.01); H01L 2224/45623 (2013.01); H01L 2224/45624 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/484 (2013.01); H01L 2224/4845 (2013.01); H01L 2224/48455 (2013.01);
Abstract
A semiconductor device includes a bond formed on a bond pad. The bond is formed of a wire that includes a central core of conductive metal, a first coating over the central core of conductive metal that is more chemically active than the conductive metal, and a second coating over the central core of conductive metal that is less chemically active than the central core of conductive metal.