Burton Jesse Carpenter

This inventor holds 34 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc., International Business Machines Corporation. Active years: 1993-2025.

USPTO Granted Patents = 34 (Patent Applications = 8)

% Patents Active = 91.2

Average Co-Inventor Count = 2.9

ph-index = 6

Forward Citations = 200(Granted Patents)

Company Filing History:

15 out of 5,491

Freescale Semiconductor,inc.

International Business Machines Corporation

Years Active: 1993-2025

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Areas of Expertise:

Semiconductor Device

Galvanic Isolation

Integrated Circuit

Power Substrates

Heat Spreader

Wirebonding

Corrosion Reduction

Bond Pad Treatment

Embedded Components

Photoresist Composition

Multilayer Interconnects

Die Assembly

34 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12347753 - Semiconductor device having galvanic isolation and method therefor (2025-07-01),

2. 12040291 - Radio frequency packages containing multilevel power substrates and associated fabrication methods (2024-07-16),

3. 11967507 - Tie bar removal for semiconductor device packaging (2024-04-23),

4. 11502068 - Semiconductor device package having galvanic isolation and method therefor (2022-11-15),

5. 11462494 - Semiconductor device package having galvanic isolation and method therefor (2022-10-04),

6. 11222790 - Tie bar removal for semiconductor device packaging (2022-01-11),

7. 11164826 - Packaged integrated circuit having stacked die and method for making (2021-11-02),

8. 10734327 - Lead reduction for improved creepage distance (2020-08-04),

9. 10734312 - Packaged integrated circuit having stacked die and method for therefor (2020-08-04),

10. 10734311 - Hybrid lead frame for semiconductor die package with improved creepage distance (2020-08-04),

11. 10446476 - Packaged integrated circuit having stacked die and method for therefor (2019-10-15),

12. 10325876 - Surface finish for wirebonding (2019-06-18),

13. 10249557 - Packaged integrated circuit device and methods (2019-04-02),

14. 10242935 - Packaged semiconductor device and method for forming (2019-03-26),

15. 9437459 - Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure (2016-09-06),

Title: The Innovative Mind of Burton Jesse Carpenter

Introduction: Burton Jesse Carpenter is a renowned inventor based in Austin, Texas. His creative spirit and passion for innovation have led to numerous groundbreaking inventions in various fields.

Latest Patents: Burton Jesse Carpenter holds several patents in the areas of technology, healthcare, and sustainable energy. His most recent patents focus on advancements in renewable energy sources and smart home technology.

Career Highlights: Throughout his career, Burton Jesse Carpenter has been recognized for his contributions to the field of innovation. He has received multiple awards for his groundbreaking inventions and has been invited to speak at prestigious conferences worldwide.

Collaborations: Burton Jesse Carpenter has collaborated with leading technology companies and research institutions to further develop his inventions. His collaborative efforts have resulted in the successful implementation of his innovative ideas in real-world applications.

Conclusion: Burton Jesse Carpenter's dedication to innovation and his relentless pursuit of new ideas continue to inspire the next generation of inventors. His impact on various industries is truly remarkable, and his legacy as a pioneering inventor is set to endure for years to come.