The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Jan. 03, 2019
Nxp Usa, Inc., Austin, TX (US);
Mariano Layson Ching, Jr., Tianjin, CN;
Burton Jesse Carpenter, Austin, TX (US);
Jinmei Liu, Tianjin, CN;
Yit Meng Lee, Selangor, MY;
Allen Marfil Descartin, Cebu, PH;
NXP USA, Inc., Austin, TX (US);
Abstract
Embodiments of a lead frame and packaged devices thereof, including a lead frame first and second rows of lead fingers respectively connected to first and second sides of the lead frame, the second side opposite the first side; a package body perimeter within which a package body of the packaged semiconductor device is formed; and a first die pad arm, wherein an end of the first die pad arm remains within the package body perimeter and is separated from the package body perimeter by a gap distance; wherein a first outermost lead finger of the first row of lead fingers is adjacent to the first die pad arm.