Company Filing History:
Years Active: 2020-2024
Title: Yit Meng Lee: Innovator in Semiconductor Packaging
Introduction
Yit Meng Lee is a prominent inventor based in Selangor, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His innovative work focuses on reducing mechanical stress in semiconductor devices, which is crucial for enhancing their performance and reliability.
Latest Patents
Yit Meng Lee's latest patents include two notable inventions. The first patent addresses a cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package. This invention involves a semiconductor package that comprises a lead frame, a die pad, bond pads, and leads. The die, which contains an integrated circuit, is arranged on the die pad. The molding compound encapsulates the die and at least a portion of the lead frame, with varying thicknesses to create a cavity that directly contacts different portions of the die.
The second patent focuses on lead reduction for improved creepage distance. This invention includes a lead frame with first and second rows of lead fingers connected to opposite sides of the lead frame. The design ensures that a first outermost lead finger of the first row is adjacent to a first die pad arm, which remains within the package body perimeter, separated by a gap distance. This innovative approach enhances the overall performance of packaged semiconductor devices.
Career Highlights
Yit Meng Lee is currently employed at NXP USA, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the efficiency and reliability of semiconductor devices, making him a valuable asset to his company and the industry.
Collaborations
Throughout his career, Yit Meng Lee has collaborated with several talented individuals, including Mariano Layson Ching, Jr. and You Ge. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Yit Meng Lee is a distinguished inventor whose contributions to semiconductor packaging have made a significant impact on the industry. His innovative patents demonstrate his commitment to enhancing the performance and reliability of semiconductor devices. His work continues to inspire future advancements in technology.