Company Filing History:
Years Active: 2019-2024
Title: Innovations by Jinmei Liu in Semiconductor Device Packaging
Introduction
Jinmei Liu is a notable inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor device packaging, holding a total of 4 patents. His innovative methods have advanced the efficiency and effectiveness of semiconductor manufacturing processes.
Latest Patents
One of Jinmei Liu's latest patents is focused on a method of tie bar removal for semiconductor device packaging. This method involves forming a leadframe that includes a tie bar and a flag. The tie bar extends from a side rail of the leadframe and has a distal portion at an angle different from the plane of the flag. A semiconductor die is attached to the flag of the leadframe, and a molding compound encapsulates the semiconductor die, a portion of the leadframe, and the distal portion of the tie bar. The tie bar is then separated from the molding compound, leaving an angled cavity in the molding compound.
Career Highlights
Jinmei Liu is currently employed at NXP USA, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.
Collaborations
Jinmei has collaborated with several talented individuals in his field, including Burton Jesse Carpenter and Mariano Layson Ching, Jr. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Jinmei Liu's contributions to semiconductor device packaging exemplify the spirit of innovation in the technology sector. His patents and collaborative efforts continue to shape the future of semiconductor manufacturing.