Nxp Usa, Inc.

Jinmei Liu

Burton Jesse Carpenter

Zhiwei Gong

Richard Te Gan

Mariano Layson Ching, Jr

Rushik Prabhudas Tank

Leo M Higgins, Iii

Jinzhong Yao

Fred T Brauchler

Xingshou Pang

Allen Marfil Descartin

Jianhong Wang

Yit Meng Lee

Yadong Wei

A method of tie bar removal is provided. The method includes forming a leadframe including a tie bar and a flag. The tie bar extends from a side rail of the leadframe and has a distal portion at an angle different from a plane of the flag. A semiconductor die is attached to the flag of the leadframe. A molding compound encapsulates the semiconductor die, a portion of the leadframe, and the distal portion of the tie bar. The tie bar is separated from the molding compound with an angled cavity remaining in the molding compound.

Tie bar removal for semiconductor device packaging

Embodiments of a lead frame and packaged devices thereof, including a lead frame first and second rows of lead fingers respectively connected to first and second sides of the lead frame, the second side opposite the first side; a package body perimeter within which a package body of the packaged semiconductor device is formed; and a first die pad arm, wherein an end of the first die pad arm remains within the package body perimeter and is separated from the package body perimeter by a gap distance; wherein a first outermost lead finger of the first row of lead fingers is adjacent to the first die pad arm.

Lead reduction for improved creepage distance

A packaged integrated circuit (IC) device includes a first IC die with a first inductor, a first layer of adhesive on a first major surface of the first IC die, an isolation layer over the first layer of adhesive, a second layer of adhesive on the isolation layer, a second IC die on the second layer of adhesive, and a second inductor in the second IC die aligned to communicate with the first inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die.

Packaged integrated circuit having stacked die and method for therefor

Growing community of inventors

Tianjin, China

Jinmei Liu