The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Jan. 07, 2019
Nxp Usa, Inc., Austin, TX (US);
Mariano Layson Ching, Jr., Tianjin, CN;
Burton Jesse Carpenter, Austin, TX (US);
Lidong Zhang, Tianjin, CN;
Kendall Dewayne Phillips, Driftwood, TX (US);
Quan Chen, Tianjin, CN;
Meng Kong Lye, Shah Alam, MY;
NXP USA, Inc., Austin, TX (US);
Abstract
Embodiments of packaged semiconductor devices and lead frames for such devices are provided, such as a lead frame including: a row of lead fingers, wherein an outer end of each lead finger is connected to a leaded side of the lead frame; a package body perimeter that indicates placement of a package body of the packaged semiconductor device, wherein an inner end of each lead finger falls within the package body perimeter; a retention tab that protrudes from an interior edge of a non-leaded side of the lead frame, wherein the retention tab falls outside of the package body perimeter; and a non-conductive tie bar structure attached to the retention tab, wherein the non-conductive tie bar structure falls within the package body perimeter.