The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Jun. 25, 2014
Varughese Mathew, Austin, TX (US);
Burton J. Carpenter, Austin, TX (US);
Leo M. Higgins, Iii, Austin, TX (US);
Chu-chung Lee, Round Rock, TX (US);
Tu-anh N. Tran, Austin, TX (US);
Varughese Mathew, Austin, TX (US);
Burton J. Carpenter, Austin, TX (US);
Leo M. Higgins, III, Austin, TX (US);
Chu-Chung Lee, Round Rock, TX (US);
Tu-Anh N. Tran, Austin, TX (US);
NXP USA, Inc., Austin, TX (US);
Abstract
The present disclosure provides embodiments of package devices and methods for making package devices for a semiconductor die. One embodiment includes a die mounting structure having a finished bond pad that includes a copper bond pad and a cobalt-containing layer over a top surface of the copper bond pad, and a wire bond structure that is bonded to a top surface of the cobalt-containing layer of the finished bond pad, where cobalt-containing material of the cobalt-containing layer is located between a bottom surface of the wire bond structure and the top surface of the copper bond pad such that the cobalt-containing material is present under a center portion of the wire bond structure.