The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Aug. 24, 2012
Leo M. Higgins, Iii, Austin, TX (US);
Chu-chung Lee, Round Rock, TX (US);
Leo M. Higgins, III, Austin, TX (US);
Chu-Chung Lee, Round Rock, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An integrated circuit wire bond connection is provided having an aluminum bond pad () that is directly bonded to a copper ball () to form an aluminum splash structure () and associated crevice opening () at a peripheral bond edge of the copper ball (), where the aluminum splash structure () is characterized by a plurality of geometric properties indicative of a reliable copper ball bond, such as lateral splash size, splash shape, relative position of splash-ball crevice to the aluminum pad, crevice width, crevice length, crevice angle, and/or crevice-pad splash index.