The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Jul. 28, 2010
Chu-chung Lee, Round Rock, TX (US);
Kian Leong Chin, Kuala Lumpur, MY;
Kevin J. Hess, Round Rock, TX (US);
Patrick Johnston, Austin, TX (US);
Tu-anh N. Tran, Austin, TX (US);
Heng Keong Yip, Shah Alam, MY;
Chu-Chung Lee, Round Rock, TX (US);
Kian Leong Chin, Kuala Lumpur, MY;
Kevin J. Hess, Round Rock, TX (US);
Patrick Johnston, Austin, TX (US);
Tu-Anh N. Tran, Austin, TX (US);
Heng Keong Yip, Shah Alam, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.