IDiyas

For the Inventor, By the Inventor

Austin, TX, United States of America

Kevin John Hess

USPTO Granted Patents = 37 

Average Co-Inventor Count = 3.3

ph-index = 12

Forward Citations = 447(Granted Patents)


Location History:

  • Addison, TX (US) (2010)
  • St. Ismier, FR (2007 - 2012)
  • Austin, TX (US) (1999 - 2016)
  • Round Rock, TX (US) (2010 - 2016)

Company Filing History:

goldMedal33 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
silverMedal4 out of 257 
 
Huntsman Petrochemical Corporation
 patents

Years Active: 1999-2016

Loading Chart...
37 patents (USPTO):
1. 9331050 - Localized alloying for improved bond reliability (2016-05-03),
2. 9331046 - Integrated circuit package with voltage distributor (2016-05-03),
3. 9099475 - Techniques for reducing inductance in through-die vias of an electronic assembly (2015-08-04),
4. 9093429 - Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices (2015-07-28),
5. 9082757 - Stacked semiconductor devices (2015-07-14),
6. 9076664 - Stacked semiconductor die with continuous conductive vias (2015-07-07),
7. 8912667 - Packaged integrated circuit using wire bonds (2014-12-16),
8. 8796822 - Stacked semiconductor devices (2014-08-05),
9. 8791582 - Integrated circuit package with voltage distributor (2014-07-29),
10. 8680674 - Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices (2014-03-25),
11. 8501539 - Semiconductor device package (2013-08-06),
12. 8368172 - Fused buss for plating features on a semiconductor die (2013-02-05),
13. 8349666 - Fused buss for plating features on a semiconductor die (2013-01-08),
14. 8318549 - Molded semiconductor package having a filler material (2012-11-27),
15. 8274146 - High frequency interconnect pad structure (2012-09-25),

Title: Kevin John Hess: Innovator in Semiconductor Technology

Introduction

Kevin John Hess is an esteemed inventor based in Austin, TX, who boasts an impressive portfolio of 37 patents. His contributions to the field of semiconductor technology have significantly influenced advancements in integrated circuit packaging and electrical interconnects.

Latest Patents

Among his latest innovations is a patent for an integrated circuit package with a voltage distributor. This invention features a semiconductor die attached to a package support, designed with a multitude of bond pads and a conductive distributor that optimizes power supply connections. Another notable patent addresses the method of localized alloying for improved bond reliability in gold-aluminum electrical interconnects. This method utilizes a diffusion retardant layer to enhance the formation of a continuous electrically conducting path between aluminum and gold.

Career Highlights

Throughout his career, Kevin has worked with prominent companies, such as Freescale Semiconductor, Inc. and Huntsman Petrochemical Corporation. His extensive experience in these organizations has enabled him to refine his skills and contribute to groundbreaking technologies in the semiconductor sector.

Collaborations

Kevin has collaborated with talented professionals during his career, including renowned individuals like Chu-Chung Lee and Michael B. McShane. These partnerships have been instrumental in fostering innovation and advancing research in their respective fields.

Conclusion

Kevin John Hess remains a significant figure in the realm of semiconductor technology with his 37 patents reflecting his commitment to innovation. His work continues to pave the way for future advancements in integrated circuit design and electronic interconnects, making him a valuable asset in the technology industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…