The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Jun. 27, 2012
Applicants:
Michael B. Mcshane, Austin, TX (US);
Kevin J. Hess, Austin, TX (US);
Perry H. Pelley, Austin, TX (US);
Tab A. Stephens, Austin, TX (US);
Inventors:
Michael B. McShane, Austin, TX (US);
Kevin J. Hess, Austin, TX (US);
Perry H. Pelley, Austin, TX (US);
Tab A. Stephens, Austin, TX (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 23/3157 (2013.01); H01L 24/48 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor device comprising a substrate, a power bus, a heat source circuit, a heat sensitive circuit, and a plurality of electrically and thermally conductive through-silicon-vias (TSVs) in the substrate. The TSVs are electrically coupled to the power bus and positioned between the heat source circuit and the heat sensitive circuit to absorb heat from the heat source circuit.