The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2013

Filed:

Jul. 22, 2011
Applicants:

George R. Leal, Cedar Park, TX (US);

Kevin J. Hess, Austin, TX (US);

Trent S. Uehling, New Braunfels, TX (US);

Inventors:

George R. Leal, Cedar Park, TX (US);

Kevin J. Hess, Austin, TX (US);

Trent S. Uehling, New Braunfels, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/332 (2006.01); H01L 21/44 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming a semiconductor structure includes forming a plurality of fuses over a semiconductor substrate; forming a plurality of interconnect layers over the semiconductor substrate and a plurality of interconnect pads at a top surface of the plurality of interconnect layers; and forming a seal ring, wherein the seal ring surrounds active circuitry formed in and on the semiconductor substrate, the plurality of interconnect pads, and the plurality of fuses, wherein each fuse of the plurality of fuses is electrically connected to a corresponding interconnect pad of the plurality of interconnect pads and the seal ring, and wherein when each fuse of the plurality of fuses is in a conductive state, the fuse electrically connects the corresponding interconnect pad to the seal ring.


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