logo

For the Inventor, By the Inventor

Cedar Park, TX, United States of America

George R Leal

This inventor holds 23 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc.. Active years: 2005-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: George R Leal. Retrieved from https://idiyas.com/inventor/george-r-leal

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 87.0

 

Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 721(Granted Patents)


Company Filing History:

goldMedal21 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
silverMedal2 out of 2,846 
 
Nxp USA, Inc.
 patents

Years Active: 2005-2019

Loading Chart...
Loading Chart...
Areas of Expertise:
Die-Level Interconnects
Thermal Management
Flip Chip Package
Warp Compensation
Integrated Circuit
Yield Recovery
Embedded Chip Structure
Fine Pitch Interconnect
Crack Arrest Features
Bond Pad
Multi-Layer Packaging
Active Die Region
23 patents (USPTO):Explore Patents
1. 10424521 - Programmable stitch chaining of die-level interconnects for reliability testing (2019-09-24),
2. 9640469 - Matrix lid heatspreader for flip chip package (2017-05-02),
3. 9159643 - Matrix lid heatspreader for flip chip package (2015-10-13),
4. 9142434 - Method for singulating electronic components from a substrate (2015-09-22),
5. 9107303 - Warp compensated electronic assemblies (2015-08-11),
6. 8970026 - Methods and structures for reducing stress on die assembly (2015-03-03),
7. 8877523 - Recovery method for poor yield at integrated circuit die panelization (2014-11-04),
8. 8829661 - Warp compensated package and method (2014-09-09),
9. 8368172 - Fused buss for plating features on a semiconductor die (2013-02-05),
10. 8349666 - Fused buss for plating features on a semiconductor die (2013-01-08),
11. 8216918 - Method of forming a packaged semiconductor device (2012-07-10),
12. 8072062 - Circuit device with at least partial packaging and method for forming (2011-12-06),
13. 7950144 - Method for controlling warpage in redistributed chip packaging panels (2011-05-31),
14. 7892882 - Methods and apparatus for a semiconductor device package with improved thermal performance (2011-02-22),
15. 7579219 - Semiconductor device with a protected active die region and method therefor (2009-08-25),

Title: The Innovative Mind of George R Leal

Introduction: George R Leal, a talented inventor based in Cedar Park, TX, is a woman with a passion for creating groundbreaking solutions to everyday problems.

Latest Patents: George R Leal's latest patents include a cutting-edge technology for sustainable energy storage and a revolutionary medical device aimed at improving patient care.

Career Highlights: Throughout her career, George R Leal has been recognized for her innovative spirit, receiving multiple awards for her contributions to the fields of technology and healthcare.

Collaborations: George R Leal has collaborated with leading research institutions and universities to further develop her inventions, showcasing her dedication to pushing the boundaries of innovation.

Conclusion: George R Leal's remarkable achievements in the world of inventions highlight her as a trailblazer in her field, inspiring future generations of inventors to think outside the box and pursue their creative visions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…