The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Oct. 23, 2008
Wei Gao, Tianjin, CN;
Craig S. Amrine, Tempe, AZ (US);
Zhiwei Gong, Tianjin, CN;
Scott M. Hayes, Chandler, AZ (US);
Lizabeth Ann Keser, Chandler, AZ (US);
George R. Leal, Cedar Park, TX (US);
William H. Lytle, Chandler, AZ (US);
Wei Gao, Tianjin, CN;
Craig S. Amrine, Tempe, AZ (US);
Zhiwei Gong, Tianjin, CN;
Scott M. Hayes, Chandler, AZ (US);
Lizabeth Ann Keser, Chandler, AZ (US);
George R. Leal, Cedar Park, TX (US);
William H. Lytle, Chandler, AZ (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
Methods for forming electronic assemblies are provided. A device substrate having a plurality of electronic components embedded therein is provided. The device substrate is attached to a carrier substrate using an adhesive material. A plurality of cuts are formed through the device substrate to divide the device substrate into a plurality of portions. Each of the plurality of portions includes at least one of the electronic components. A force is applied to each of the plurality of portions in a direction away from the carrier substrate to remove the plurality of portions from the carrier substrate.