William H Lytle

Title: **William H. Lytle: A Pioneer in Electronic Component Innovations**

Introduction

William H. Lytle, based in Chandler, AZ, has made significant contributions to the field of electronic components through his innovative inventions. With a remarkable portfolio of 28 patents, Lytle has dedicated his career to advancing technology in the electronics industry.

Latest Patents

Among Lytle's most recent patents is a groundbreaking method for singulating electronic components from a substrate. This method involves a device substrate containing multiple embedded electronic components, which is attached to a carrier substrate with an adhesive material. By forming cuts through the device substrate, it divides into portions, each with at least one electronic component. A force is then applied to remove these portions from the carrier substrate.

Another notable patent is his work on warp compensated electronic assemblies. In this invention, an electronic panel assembly integrates one or more electronic devices mounted face down in openings of a warp control sheet (WCS). Cured plastic encapsulation is applied to mitigate undesirable warping during the process, achieved by carefully selecting the WCS's coefficient of thermal expansion (CTE) to be less than that of the encapsulation CTE. Moreover, thin film insulators and conductors are utilized to connect electrical contacts across various devices, creating an integrated multi-device electronic panel assembly.

Career Highlights

William H. Lytle's career includes significant stints at leading technology firms. He has worked for Freescale Semiconductor, Inc. and Motorola Corporation, where he honed his skills in developing cutting-edge electronic technologies. His experience at these renowned companies has contributed to his extensive knowledge and expertise in the field.

Collaborations

Throughout his illustrious career, Lytle has collaborated with esteemed colleagues, including Craig S. Amrine and Owen R. Fay. Their combined efforts have further propelled innovation in electronic component technologies, emphasizing the importance of teamwork in research and development.

Conclusion

William H. Lytle's innovative spirit and commitment to advancing electronic technologies are evident in his extensive patent portfolio. His latest inventions exemplify the forward-thinking approach required to address challenges in the electronics industry. As he continues to develop new technologies, Lytle's impact on the field will undoubtedly inspire future generations of inventors and engineers.