The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2009
Filed:
Aug. 29, 2007
William H. Lytle, Chandler, AZ (US);
Owen R. Fay, Boise, ID (US);
Jianwen Xu, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A structure () for holding an integrated circuit die () during packaging includes a support substrate (), a release film () attached to the substrate (), and a swelling agent (). A method () of packaging the die () includes placing the die () on the substrate () with its active surface () and bond pads () in contact with the film (). The agent () is applied over an adhesive coating () of the film (). The agent () causes the adhesive () to swell into contact with the bond pads () and/or to form fillets () of adhesive () about the die (). The die () is encapsulated in a molding material () and released from the substrate () as a panel () of dies (). Swelling of the adhesive () about the bond pads () prevents the molding material () from bleeding onto the bond pads ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile