The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Jul. 01, 2003
Gregory J. Dunn, Arlington Heights, IL (US);
Owen R. Fay, Gilbert, AZ (US);
Timothy B. Dean, Elk Grove, IL (US);
Terance Blake, Palatine, IL (US);
Remy J. Chelini, Crystal Lake, IL (US);
William H. Lytle, Chandler, AZ (US);
George A. Strumberger, Gilberts, IL (US);
Gregory J. Dunn, Arlington Heights, IL (US);
Owen R. Fay, Gilbert, AZ (US);
Timothy B. Dean, Elk Grove, IL (US);
Terance Blake, Palatine, IL (US);
Remy J. Chelini, Crystal Lake, IL (US);
William H. Lytle, Chandler, AZ (US);
George A. Strumberger, Gilberts, IL (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.