The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Sep. 29, 2008
Applicant:
William H. Lytle, Chandler, AZ (US);
Inventor:
William H. Lytle, Chandler, AZ (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming a semiconductor package includes forming a coating over a first device, attaching the first device to a substrate using an adhesive, encapsulating the first device using an encapsulant material, releasing the first device from the substrate using the adhesive, removing a portion of the encapsulant material that is over the first device to expose the coating, and removing the coating over the first device to expose a portion of the first device.