The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
Dec. 27, 2007
William H. Lytle, Chandler, AZ (US);
Craig S. Amrine, Tempe, AZ (US);
William H. Lytle, Chandler, AZ (US);
Craig S. Amrine, Tempe, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method is described for manufacturing electronic assemblies (). Electronic die () held in a plastic matrix () form a partially completed panel () of electronic assemblies (). The panel () is adhesively mounted to a ceramic carrier () having multiple holes () there through. Conductive interconnects (--etc.) and other layers are applied to the panel, coupled to electrical contacts on the die () and external electrical contacts (-) for the panel (). The panel () and the carrier () are separated and the panel singulated to release the finished electronic assemblies (). Silicone is a preferred adhesive () and is dissolved using a non-polar solvent () that penetrates through the holes () in the carrier () to the adhesive (). The adhesive () is preferentially applied using a transfer adhesive sandwich (), that is, an adhesive layer () with removable plastic sheets () on either side that can be peeled away from the adhesive (). This facilitates handling and properly locating the adhesive () on the carrier () for efficient low cost manufacture of the assemblies ().