The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Nov. 23, 2009
Jianwen Xu, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
William H. Lytle, Chandler, AZ (US);
Jianwen Xu, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
William H. Lytle, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
Methods for forming a microelectronic assembly () are provided. In one embodiment, the method includes providing a device substrate () having a plurality of electronic components () coupled thereto, and providing a carrier substrate () having first and second opposing surfaces () and including a plurality of openings () extending between the first and second opposing surfaces () and a plurality of depressions () formed on the first opposing surface (). The method further includes attaching the device substrate () to the first opposing surface () of the carrier substrate () using an adhesive material () such that at least some of the adhesive material () is adjacent to at least some of the plurality of depressions (), and removing the device substrate () from the carrier substrate ().