The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Mar. 10, 2006
William H. Lytle, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
George R. Leal, Cedar Park, TX (US);
William H. Lytle, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
George R. Leal, Cedar Park, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
Methods and apparatus are provided for an electronic panel assembly (EPA) (), comprising: providing one or more electronic devices () with primary faces () having electrical contacts (), opposed rear faces () and edges () therebetween. The devices () are mounted primary faces () down on a temporary support () in openings () in a warp control sheet (WCS) () attached to the support (). Plastic encapsulation () is formed at least between lateral edges () of the devices () and WCS openings (). Undesirable panel warping () during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. After encapsulation cure, the EPA () containing the devices () and the WCS () is separated from the temporary support () and, optionally, mounted on another carrier () with electrical contacts () exposed. Thin film insulators () and conductors () are desirably applied to couple electrical contacts () on various devices () to each other and to external terminals (), thereby forming an integrated multi-device EPA ().