Wei Gao

This inventor holds 10 USPTO granted patents. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei Gao. Retrieved from https://idiyas.com/inventor/wei-gao-zpmjhbag

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 10

% Patents Active = 90.0

Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 38(Granted Patents)

Company Filing History:

5 out of 5,491

Freescale Semiconductor,inc.

Years Active: 2012-2026

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12525511 - Semiconductor device with resin bleed control structure and method therefor (2026-01-13),

2. 10283477 - Method of fabricating 3-dimensional fan-out structure (2019-05-07),

3. 10083912 - Method of packaging integrated circuit die and device (2018-09-25),

4. 10068841 - Apparatus and methods for multi-die packaging (2018-09-04),

5. 9721881 - Apparatus and methods for multi-die packaging (2017-08-01),

6. 9362211 - Exposed pad integrated circuit package with mold lock (2016-06-07),

7. 9142434 - Method for singulating electronic components from a substrate (2015-09-22),

8. 9034697 - Apparatus and methods for quad flat no lead packaging (2015-05-19),

9. 8735223 - Semiconductor devices and methods of assembling same (2014-05-27),

10. 8329509 - Packaging process to create wettable lead flank during board assembly (2012-12-11),

Title: Wei Gao - Innovator in Integrated Circuit Technology

Introduction

Wei Gao is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of integrated circuit technology, holding a total of 10 patents. His innovative approaches have paved the way for advancements in semiconductor manufacturing and packaging.

Latest Patents

Wei Gao's latest patents include a method of fabricating a 3-dimensional fan-out structure. This method involves providing a substrate carrier with an aperture and bonding a semiconductor die to the first surface. The encapsulant and a second die are then deposited within the aperture, ensuring that the active surface of the second die is coplanar with the second surface of the substrate carrier. Additionally, he has developed a method of packaging integrated circuit die and device, which includes attaching a package substrate to a temporary carrier and connecting bond wires between interconnects at the active surface of the second die and the substrate.

Career Highlights

Throughout his career, Wei Gao has worked with notable companies such as Freescale Semiconductor, Inc. and NXP USA, Inc. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the semiconductor industry.

Collaborations

Wei Gao has collaborated with talented individuals in his field, including Zhiwei Gong and Dehong Ye. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Wei Gao's contributions to integrated circuit technology and his impressive portfolio of patents highlight his role as a leading inventor in the semiconductor industry. His work continues to influence advancements in the field, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]