Company Filing History:
Years Active: 2012-2019
Title: Wei Gao - Innovator in Integrated Circuit Technology
Introduction
Wei Gao is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of integrated circuit technology, holding a total of 9 patents. His innovative approaches have paved the way for advancements in semiconductor manufacturing and packaging.
Latest Patents
Wei Gao's latest patents include a method of fabricating a 3-dimensional fan-out structure. This method involves providing a substrate carrier with an aperture and bonding a semiconductor die to the first surface. The encapsulant and a second die are then deposited within the aperture, ensuring that the active surface of the second die is coplanar with the second surface of the substrate carrier. Additionally, he has developed a method of packaging integrated circuit die and device, which includes attaching a package substrate to a temporary carrier and connecting bond wires between interconnects at the active surface of the second die and the substrate.
Career Highlights
Throughout his career, Wei Gao has worked with notable companies such as Freescale Semiconductor, Inc. and NXP USA, Inc. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the semiconductor industry.
Collaborations
Wei Gao has collaborated with talented individuals in his field, including Zhiwei Gong and Dehong Ye. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Wei Gao's contributions to integrated circuit technology and his impressive portfolio of patents highlight his role as a leading inventor in the semiconductor industry. His work continues to influence advancements in the field, showcasing the importance of innovation in technology.