The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Jul. 14, 2011
Applicants:
Zhiwei Gong, Chandler, AZ (US);
Jianwen Xu, San Diego, CA (US);
Wei Gao, Tianjin, CN;
Scott M. Hayes, Chandler, AZ (US);
Inventors:
Zhiwei Gong, Chandler, AZ (US);
Jianwen Xu, San Diego, CA (US);
Wei Gao, Tianjin, CN;
Scott M. Hayes, Chandler, AZ (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 23/49537 (2013.01); H01L 23/49548 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 21/4821 (2013.01); H01L 2224/48247 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/49171 (2013.01); H01L 23/3107 (2013.01);
Abstract
A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame, and connecting other components on the lead frame to the lead elements.