The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Feb. 16, 2012
Wei Gao, Tianjin, CN;
Zhiwei Gong, Chandler, AZ (US);
Dehong YE, Tianjin, CN;
Huchang Zhang, Tianjin, CN;
Wei Gao, Tianjin, CN;
Zhiwei Gong, Chandler, AZ (US);
Dehong Ye, Tianjin, CN;
Huchang Zhang, Tianjin, CN;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of forming a semiconductor device includes affixing a die to a heat sink to form a die and heat sink assembly and then placing the die and heat sink assembly on a support element. A semiconductor device includes a die and heat sink assembly disposed on a support element. The die and heat sink assembly is pre-assembled prior to being disposed on the support element.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile